| 摘要 |
<p>PURPOSE:To make small the thickness of a resin-sealed multi-chip package having at its center a wiring substrate on which a plurality of semiconductor chips are installed. CONSTITUTION:A resin sealed multi-chip package has a lead frame 10 provided with a substrate arrangement area K for arranging a wiring substrate 20 on which a prulality of semiconductor chips 31 and 32 are installed, and a plurality of inner leads 11 the inner end parts of which are opposed each other on a plane surrounding the substrate arragement area K and substantially in the same location as the substrate arragement area, and the outer end part of which is connected to the outer terminals. In such a package, the inner leads 11 are partially extended over the substrate arrangement area K, and the wiring substrate 20 is mounted and fixed to the upper surface of the extended part. Further, each inner end of the extended inner leads 11A to 11G and the electrode pattern on the wiring substrate 20 or any of the given electrode pads 31A to 31G on the wiring substrate 20 are connected directly by wire bonding.</p> |
