| 摘要 |
PURPOSE:To prevent a short circuit due to contact with a heat sink by a method wherein a stepped part whose height is equal to an electrode on the side of a board for a semiconductor laser or which is extremely small is formed on a pedestal for semiconductor mounting use. CONSTITUTION:A stepped part 15 which is equal to an electrode on the side of a board for a semiconductor laser 17 or whose height difference is within 1 mm is formed in a part on the side opposite to the radiating edge of the semiconductor laser 17 inside the surface of a pedestal 12 on which the semiconductor laser 17 is mounted. The stepped part 15 depends on the height of a heat sink 18 and the semiconductor laser 17. It is formed in such a way that the surface of the electrode on the side of the board for the semiconductor laser 17, the pedestal 12 and the stepped part 15 becomes nearly equal when the heat sink 18 and the semiconductor laser 17 are mounted. Consequently, a bonding wire which connects the semiconductor laser 17 to the stepped part 15 draws a gentle curve, and a bonding defect is eliminated. Thereby, it is possible to prevent a short circuit due to contact with the heat sink 18. |
