| 摘要 |
PURPOSE:To perform a wire bonding with suitable bonding strength and shape by providing regulating means for regulating the rising time to the normal output value of supersonic output waveform in the super sonic wave oscillator of a super sonic wire bonding apparatus. CONSTITUTION:A transducer 18 is vibrated by a supersonic wave output from a supersonic wave oscillator 17, and portions to be bonded are wire bonded by a bonding tool 20 disposed at the transducer. In a supersonic wave wire bonding apparatus 10, a rising regulating means for regulating the rising time to the normal output value of the supersonic output waveform is provided in the oscillator 17 to safely and effectively perform a wire bonding to the portions to be bonded in suitable bonding strength in response to the materials to be bonded and of wires and stable ball shape. |
