| 摘要 |
<p>PURPOSE:To obtain a semiconductor device which can extract signals and power source from an internal bump arranged in an internal circuit forming region of a semiconductor substrate without reducing the number of peripheral bumps which may be arranged at the external circumference of a semiconductor substrate. CONSTITUTION:Height of an internal bump 3 arranged in an internal circuit forming region on a semiconductor substrate 1 is set higher than that of an peripheral bump 2 arranged at the external circumference, the peripheral bump 2 is connected with an external bump lead 5 fixed and supported by a first tape carrier 4, the internal bump 3 is connected with an internal bump lead 7 fixed and supported by a second tape carrier 6 and this internal bump lead 7 is extended to the upper side of the peripheral bump 2.</p> |
