| 摘要 |
PURPOSE:To eliminate fibrous dust particles produced when a parts tape is stripped from a top tape and to eliminate that a suction nozzle is clogged in an electronic-component mounting apparatus in which an electronic component fed by means of the parts tape is sucked by means of the suction nozzle and mounted on a circuit board. CONSTITUTION:The title apparatus is constituted in the following manner: a punching means 8 which punches cutting-off holes in a to tape 4 is arranged and installed on the upstream side of a stripping part 5 which strips the top tape 4 from a carrier tape 1. When the top tape 4 is stripped at the stripping part 5, the top tape 4 is cut off at the cutting-off holes and no stripping force is exerted on the bonding part of the carrier tape 1 to the top tape 4. Thereby, it is possible to eliminate fibrous dust particles produced when the bonding part is stripped, to eliminate that a suction nozzle sucks the dust particles and to eliminate that the nozzle is clogged. |
