| 摘要 |
PURPOSE:To prevent swollen plating from being caused by arranging the same material as that of a dielectric ceramic around the dielectric ceramic and sintering them under a high density environment so as to uniformize the roughness of an outer surface of the dielectric ceramic and an inner surface of a throughhole thereby uniformizing close adhering strength of a plating film. CONSTITUTION:A ceramic of TiO2-ZrO2-SnO2 group or the like is employed for a material for a dielectric ceramic 1 and the ceramic 1 is formed in a rectangular parallelopiped having a throughhole 2. A floor plate 12 made of the same material as that of the dielectric ceramic 1 is placed in the middle of a bowl 8, the dielectric ceramic 1 is placed on the plate 12 and a block sintered body 13 made of the same material as the dielectric ceramic 1 is arranged around the ceramic 1. Then a cover 8a is placed on the dielectric ceramic 1 and the assembly is sintered for fine hours at, e.g. 1500 deg.C. Then the dielectric ceramic 1 is sintered under the high concentration environment to make the roughness of the outer surface 10 of the dielectric ceramic 1 uniform with the roughness of the inner surface 11 of the throughhole. |
