| 摘要 |
An apparatus and method for wafering an ingot of semiconductor material. Wafering blades are fabricated from one or more layers of a fiber reinforced plastic tape and coated with an abrasive material which is embedded into the exposed flat surfaces of the blades. An assembly of such blades is used in a wafering device in which the blades are reciprocated while the ingot is plunged against the cutting edges of the blades. The primary cutting action occurs as exposed ends of the fiber material at the blade edges contact the ingot. The abrasive material on the blade sides provides additional side cutting action and produces a polished finish on the surfaces of the resulting wafers. |
