SYSTEM FOR ENCAPSULATING A LEAD FRAME WITH CHIPS

摘要

Lead frames (16) on which chips are arranged are encapsulated with plastic material by placing the lead frame (6) in a mould (34) which is injected full of the encapsulating material (9). Due to the increasing number of leads resulting from dense packing the passage openings between the leads on the frame are becoming increasingly smaller. In the case of single gating the danger arises that the material (9) cannot reach the other side of the frame (6) to a sufficient extent. This leads to loss of quality which is obviated by the invention in that at the position of the point (17) of injection the moulds (34) are offset relative to one another so that a larger passage opening is created.