| 摘要 |
PURPOSE:To provide a method for forming a via conductor of a multilayer ceramic substrate for enhancing reliability of the via conductor. CONSTITUTION:A via hole 2 is provided on a green sheet 1, a metal powder 3 is filled into the via hole 2, and a land 4 for connecting the via is formed on a single or both surfaces of the above green sheet 1. And then, the green sheet 1 is laminated and calcined, thus enabling the green sheet 1 to be sintered to a one-piece ceramic plate 51. In a method for manufacturing the multilayer ceramic substrate for sintering the metal powder 3 within the via hole 2 to a one-piece via conductor 52 and then performing press treatment in equal direction of the above ceramic plate 51, etc., an inorganic matter 7 with 1-10vol.% is mixed in the above metal powder 3 and then a mixture of this metal powder 3 and the inorganic matter 7 is filled into the via hole 2. |
