| 发明名称 |
EPOXY RESIN COMPOSITIONS CONTAINING POLYSUBSTITUTED NOVOLAC EPOXY RESINS AND NAPHTHYLENE BASED PHENOLIC RESIN CURING AGENTS AND SEMICONDUCTOR DEVICES ENCAPSULATED THEREWITH |
| 摘要 |
An epoxy resin composition comprising (A) a specific epoxy resin, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is suitable for encapsulating semiconductor devices.
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| 申请公布号 |
US5166228(A) |
申请公布日期 |
1992.11.24 |
| 申请号 |
US19910739447 |
申请日期 |
1991.08.02 |
| 申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
SHIOBARA, TOSHIO;TOMIYOSHI, KAZUTOSHI;FUTATSUMORI, KOJI;TSUCHIYA, TAKASHI;AOKI, TAKAYUKI |
| 分类号 |
C08G59/62;C08G8/00;C08G8/08;C08G59/00;C08G59/08;C08G59/20;C08G59/32;C08L63/00;C08L63/04;C08L83/05;H01B3/40;H01L23/29;H01L23/31 |
主分类号 |
C08G59/62 |
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