发明名称 |
Process for manufacturing integrated device with improved connections between the pins and the semiconductor material chip |
摘要 |
A process for manufacturing devices with improved connections between the pins and the semiconductor material chip which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads and with high reliability of the connections, the connecting wires are made of different materials. Advantageously, the wires for the power connections are based on aluminum and have large diameters, and the wires for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends of the pins on which the connecting wires are to be soldered are gold-plated.
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申请公布号 |
US5165590(A) |
申请公布日期 |
1992.11.24 |
申请号 |
US19920867646 |
申请日期 |
1992.04.13 |
申请人 |
SGS-THOMSON MICROELECTRONICS S.R.L. |
发明人 |
CINI, CARLO;MASSIRONI, ANGELO;SISTI, LUIGI |
分类号 |
H01L21/60;H01L21/607;H01L23/49;H01L23/495 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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