| 摘要 |
PURPOSE:To obtain the manufacturing method of a multilayered wiring board wherein imperfect bonding of a wiring layer and an adhesive insulating layer of a circuit board for an inner layer can be prevented, and treatment agent in the course of manufacturing is hard to be left on the interface of the above layers. CONSTITUTION:When a multilayered wiring board is manufactured by forming an oxide film 2 composed of CuO and Cu2O on the surface by oxidizing a copper foil wiring layer 1 of a circuit board for an inner layer, and by laminating a plurality of said circuit boards via adhesive insulating layers, oxidizing is performed by using alkaline oxidation treatment liquid in which sodium hydroxide of 30g/l or more is contained. The ratio Cu2O/CuO in the oxide film becomes higher than or equal to 80%. When the percentage of Cu2O having large acid resistance is increased, the acid resistance of the oxide film 2 is also increased, so that the oxide film 2 of the wiring layer 1 is hard to be dissolved, when oxidizing is suitably performed in the course of manufacturing a multilayered wiring board. Thereby haloing phenomenon wherein metal copper of the wiring layer 2 is partially exposed can be restrained. |
