| 摘要 |
<p>PURPOSE:To obtain an IC card susceptible to high mounting density by loading both surfaces of one substrate with IC chip parts or the like and bending the substrate. CONSTITUTION:An IC card 1 is characterized by that the electrical connection parts 9 with a connector 8 are provided to both ends of one substrate 3 and both surfaces of one substrate are loaded with IC chip parts 4 or the like and the substrate 3 is bent at the central part thereof in a longitudinal direction and the ends of the bent substrate are respectively inserted in the respective insertion ports of the connector 8 having terminals 7 for the electrical connection parts 9 to fix the substrate 3. Since the IC chip parts 4 or the like can be mounted in the IC card in a four-layer structure, the mounting area of the substrate increases and high density mounting becomes possible.</p> |
