| 摘要 |
<p>PURPOSE:To prepare a solvent-based solder resist ink which is used for the cover coating of a circuit board, is excellent in flexibility, heat resistance, and adhesive properties, and gives a coating film free from curling by compounding a plurality of specific compds. as essential components into a solvent. CONSTITUTION:A solder resist ink based on a solvent (e.g. N-methylpyrrolidone) and used for the cover coating of a circuit board is prepd. by compounding polyparabanic acid (e.g. one obtd. from HCN and 4,4'-diphenylmethane diisocyanate), a phenoxy resin (e.g. Phenotohto YP 50, a product of Tohto Kasei Co., Ltd.), and an epoxy resin (e.g. Denacol EX 313, a product of Nagase Kasei Co., Ltd.) as essential components into the solvent.</p> |
