发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain sensitivity to radiation and to enable use as a resist material by incorporating a compound to generate a base by irradiation with specified radiation and a compound to be hardened or decomposed in basic conditions. CONSTITUTION:The compound to be added is hardened or decomposed in basic conditions, and the other compound to be added is allowed to generate the base by irradiation of radiation and represented by formula I in which each of R1-R3 is, independently, H, halogen, <=5C alkyl, such as methyl, ethyl, or propyl, alkenyl, such as vinyl, propylenyl, alkynyl, such as acetynyl, phenyl, or alkoxy, such as methoxy, ethoxy, or propoxy.
申请公布号 JPH04330444(A) 申请公布日期 1992.11.18
申请号 JP19910132472 申请日期 1991.06.04
申请人 MITSUBISHI ELECTRIC CORP 发明人 KUMADA TERUHIKO;TANAKA SACHIKO;HORIBE HIDEO;KUBOTA SHIGERU;HIZUKA YUJI
分类号 G03F7/004;G03F7/028;G03F7/038;G03F7/039;H01L21/027;H01L21/30 主分类号 G03F7/004
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