| 发明名称 |
Method and apparatus for fluxless solder reflow |
| 摘要 |
A method for reflowing solder without flux includes the steps of placing a first metallic element in contact with a second, solder-plated element, thereby defining a bond site; and causing a laser beam to impinge on the bond site. An apparatus for performing the above method is also disclosed.
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| 申请公布号 |
US5164566(A) |
申请公布日期 |
1992.11.17 |
| 申请号 |
US19900536973 |
申请日期 |
1990.06.12 |
| 申请人 |
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORP. |
发明人 |
SPLETTER, PHILIP J.;GALANAKIS, CLAIRE T.;FLYNN, WILLIAM G. |
| 分类号 |
B23K1/005;H01L21/60;H05K3/34 |
主分类号 |
B23K1/005 |
| 代理机构 |
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