| 摘要 |
PURPOSE:To provide gold resinated paste having increased bonding strength and stable reliability in relation to the low reliability problem of bonding between an IC and a print board concerning gold resinated paste used for bare chip mounting of the IC for which a microbump bonding system is employed. CONSTITUTION:On formation of a gold film during the process of firing powder which includes at least one kind among fine powders of graphite, carbon black or organic substance is blended in a gold resinated paste sold in markets within a range from 4wt.% to 13wt.% so that the fine powder made of graphite, carbon black or an organic substance, that has been blended therein, may burn up, and the parts occupied by the fine powder are formed into recesses on the surfaces of the goldfim after the firing. Thereby it is possible to obtain an IC mounting pad 4a whose gold film surface is entirely formed rough in surface roughness. Accordingly, bonding strength is increased and reliability is stabilized during the process of mounting an IC 2 on a print circuit board 1. |
