TAPERED SEMICONDUCTOR DEVICE PACKAGE

摘要

A semiconductor device (12) is attached to a first side of a carrier substrate (14), and an encapsulant material (18) is molded about the semiconductor device (12) to form a cover. The encapsulant material covers the semiconductor device and most of the first side of the carrier substrate (14). A central portion of the molded material over the semiconductor device is of uniform thickness and substantially parallel to the semiconductor device. The remaining peripheral portion (22) of the cover is tapered away from the center of the device (12), such that the cross-sectional thickness of the tapered area (22) diminishes as it approaches the edge of the carrier substrate.