| 摘要 |
PURPOSE:To enhance the reliability of a multichip type semiconductor package in which multiple semiconductor chips are mounted at a holder and are connected to a substrate by readily testing the single chip using pads on the surface of the holder and enabling the inspection of the holder connector using lands on the outer surface of the substrate. CONSTITUTION:A semiconductor chip 4 is mounted on each holder 2. A pad 13 connected to a pad 12 connected through a wire 5 to the terminal 16 of the chip is formed on the surface of the holder, and is connected by 1:1 to the land 14 on the back surface through an internal conductor 15. A solder bump 3 is provided on the land 14. A land confronting the land 14 is formed on the surface of the package substrate 1, is secured with the bump 3, and is connected at 1:1 to a land 19 for inspecting the back surface of the substrate 1 through the internal wire of the substrate 1. Thus, the propriety of the connection of the holder can be inspected by bringing probes 22, 24 into contact with the land 19 and the pad 13, and the sole chip can be inspected by suitably using the pad 13. Further, when the chip malfunctions, it can be easily replaced, and can also be effective for the improvement of the package and the reduction of the cost thereof. |
