| 发明名称 |
PROTECTIVE LAYER FOR ELECTROACTIVE PASSIVATION LAYERS |
| 摘要 |
Hard, mechanically and chemically stable protective layers for electroactive passivation layers of semiconductor components, which also act as diffusion barriers against moisture and ions, comprise a thin layer of amorphous, hydrogenated carbon. |
| 申请公布号 |
US5162875(A) |
申请公布日期 |
1992.11.10 |
| 申请号 |
US19900473619 |
申请日期 |
1990.02.01 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
BIRKLE, SIEGFRIED;KAMMERMAIER, JOHANN;SCHMIDT, GERHARD;SCHULTE, ROLF-W. |
| 分类号 |
H01L29/78;C23C16/26;H01L21/312;H01L21/56;H01L23/29 |
主分类号 |
H01L29/78 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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