摘要 |
Apparatus 1 for interconnecting integrated circuit devices 2, extending in a row 16, column 17 and stack 19 with circuit boards 3 assembled to corresponding circuit devices 2, and jumper circuit boards 4 assembled to said circuit boards 3 with arrays of contacts 6, 7, and 15 interconnecting to the boards with the assembly forming a three-dimensional interconnection of devices.
|