| 摘要 |
PURPOSE:To obtain a curved surface multilayer wiring board, on which there is not exfoliation of a copper foil or pattern discontinuity in lands and patterns and which has highly reliable through holes to connect layers to each other and is molded into the form of a desired curved surface. CONSTITUTION:An internal layer pattern formation 2 is performed on an internal layer copper-clad board 1 in a plane state, reference hole processings 3 are performed together on an external layer single-sided copper-clad laminated board 4 and a prepreg 5 and a molding of a curved surface and the lamination of the boards 1 and 4 and the prepreg 5 are simultaneously performed by a heat press 7 using a molding jig 22. Then, after a perforation processing 9 is performed using a five-axis NC, through holes are formed and thereafter, a resist film formation 13 is performed and a direct patterning to the curved surface is performed by a laser exposure 14 using the five-axis NC to form an external layer pattern. |
