Pivotal heat sink assembly

摘要

This invention provides a heat sink assembly for cooling electrical and electronic circuits. A low cost assembly method is achieved by a pivotal assembly containing a heat sink which snaps into place adjacent to an electrical/electronic circuit which requires cooling. The snap-in heat sink assembly contains a resilient heat transfer material which is exposed to the devices requiring heat removal by windows or other openings in a plate which is disposed between the heat transfer material and the snap-in frame.