| 摘要 |
PURPOSE:To automatically mount an electronic component on a board with a necessary minimum mounting space. CONSTITUTION:Component inserting means B for inserting leads 3a of an electronic component 3 into a hole 2a of a board 2, is provided at one side surface of the board 2, lead pressure contact means C for deforming to bring the leads 3a protruding from the hole 2a into pressure contact with the other side surface of the board 2, is provided, and mounting position varying means D for variably controlling a relative position of the means B and C to the board 2 is provided. |
