发明名称 MULTILAYERED WIRING BOARD WITH BUILT-IN TERMINATING RESISTANCE
摘要 <p>PURPOSE:To provide a multilayered wiring board with a built-in terminating resistance which has a very fine shape, high mechanical property, and reliability and is mounted on a copper/polyimide multilayered wiring section on which a device for making a relatively large current to flow to the terminating resistance is mounted. CONSTITUTION:In this multilayered wiring board with a terminating resistance provided with a supporting substrate 1, copper/polyimide multilayered wiring section 2 which uses a polyimide resin layer integrally formed on the main surface of the substrate 1, and the terminating resistance formed in the wiring section 2, the resistance 3 is buried in the section 2 so as to pass through the lowest-layer interlayer insulator 2a of the section 2 and one end side of the resistance is provided on the other edge side face of a metallic post 5 which is brought into contact with the surface of the substrate 1 through an inorganic insulating layer 6. In addition, the metallic post is made of copper or nickel and the layer 6 is made of SiO2, Si3N4, or SiC.</p>
申请公布号 JPH04309250(A) 申请公布日期 1992.10.30
申请号 JP19910075045 申请日期 1991.04.08
申请人 TOSHIBA CORP 发明人 MIYAGI TAKESHI
分类号 H01L23/12;H01L23/538;H05K1/00;H05K1/16 主分类号 H01L23/12
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