| 摘要 |
PURPOSE:To lessen a capillary in abrasion loss by a method wherein the contact point of a wire material to the capillary is dispersed by changing the actual bonding position of the wire material to a second bonding section. CONSTITUTION:A first bonding part is formed on a first bonding pad 17 of a pellet 16, and then a capillary is made to move three-dimensionally relative to the first bonding pad 17 through an X-Y table and a bonding head. The intermediate part of the wire material is pressed against the bonding area 11 of a first inner lead 9 of a first lead frame 2A and bonded through thermocompression and ultrasonic vibration. At this point, an X-Y table controller positions the capillary at a previously stored first shift bonding position P2a shifting it from a reference second bonding position P2. |
