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发明名称
RESIN SEALED INTEGRATED CIRCUIT PACKAGE
摘要
申请公布号
JPH04306869(A)
申请公布日期
1992.10.29
申请号
JP19910071060
申请日期
1991.04.03
申请人
OKI ELECTRIC IND CO LTD
发明人
KIMURA MASARU
分类号
H01L21/60;H01L23/28;H01L23/50
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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