Superconducting ceramic film-forming paste.

摘要

A multi-layer superconducting circuit substrate, comprising insulating layers and interconnection patterns of a superconductive ceramic material located between the insulating layers, the patterns of the superconductive ceramic material being connected via through-holes in the superconductive ceramic material, is provided. The patterns of the superconductive ceramic material are preferably encapsulated with a noble metal which is preferably gold, silver, platinum or an alloy thereof.