发明名称 Solderless system for retention and connection of a contact with a plastic circuit element
摘要 A molded plastic circuit element such as connector (50) includes a housing (52) molded of plastic to be nonresilient and have a plurality of cavities (68) into which are inserted compliant spring portions (44) of compliant pin contacts (42), for self-retention therein by strong interference fit. The side walls of the cavities (68) are plated to a substantial thickness (70) of copper or the like equivalent to about one ounce. An assured electrical connection is formed by the compliant pin (42) with the plating material (70) without solder, the plating material remaining assuredly integral to define a gastight connection over long-term in-service use. The contacts (42) of the array can enable mating with a corresponding connector (18) while circuit paths (74) extend from the plated cavities (68) to another array of pads (90) to connect to a circuit element (20) and interconnect it with connector (18). Such a connector (110) can have two arrays of such pins in such cavities, to interconnect two circuit boards (12,20) with plated circuit paths (144) connecting associated cavities of the arrays.
申请公布号 US5158470(A) 申请公布日期 1992.10.27
申请号 US19910704552 申请日期 1991.05.23
申请人 AMP INCORPORATED 发明人 ZARREII, MANSOUR
分类号 H01R12/58;H05K7/14 主分类号 H01R12/58
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