Method of external circuitization of a circuit panel
摘要
A strippable thin film of Cu is applied above the surface features of a microelectronic circuit package to protect the features during mechanical working, for example drilling, the panel. The thin film is then stripped off of the panel. The thin film may be stripped off of the panel either prior to or after circuitization.
申请公布号
US5158645(A)
申请公布日期
1992.10.27
申请号
US19910754106
申请日期
1991.09.03
申请人
INTERNATIONAL BUSINESS MACHINES, INC.
发明人
COVERT, KATHLEEN L.;EMMONS, CHARLES C.;FOSTER, ELIZABETH;MALEK, RICHARD W.;MARKOVICH, VOYA R.;TISDALE, STEPHEN L.;TYTRAN, CHARYL L.
