| 摘要 |
An optical communication arrangement and method is disclosed which utilizes a combination of leadframe and package molding technology to reduce the complexity of the arrangement. In general, a leadframe (20) is utilized for the placement and connection of the required electronic circuitry (24). An optical device (32) is also coupled to the leadframe, where a subassembly may be used to house the optical device. The electronics and optics are then simultaneously encapsulated in a molded outer package (50) to form the final arrangement. In one embodiment, an optical subassembly incorporating a fiber optic connector receptacle (52) may be utilized, wherein the molded outer package is configured such that the connector receptacle remains exposed. Alternatively, the molded outer package may be configured to include the connector receptacle. |
