RESIN COMPOSITION FOR SEALING SEMICONDUCTOR,申请号JP19910130717-传众专利搜索

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发明名称	RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要
申请公布号	JPH04292614(A)	申请公布日期	1992.10.16
申请号	JP19910130717	申请日期	1991.03.19
申请人	SUMITOMO BAKELITE CO LTD	发明人	IWASAKI SHINICHI
分类号	C08G59/24;C08G59/00;C08G59/20;C08G59/62;C08L63/00;H01L23/29;H01L23/31	主分类号	C08G59/24
代理机构		代理人
主权项
地址

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