| 摘要 |
PURPOSE:To improve heat radiating property in the mounting structure of a hybrid integrated circuit device. CONSTITUTION:In a hybrid integrated circuit device 1, where desired electronic parts are mounted on the specified area of a wiring substrate 10, the internal ends of a plurality of leads 3 are joined to the circumference of the wiring substrate 1 and the internal end portions of wiring substrate 10 and leads are packaged 2 by resin, a part of the leads is formed widely extending to the arrangement area of a plurality of leads in order to increase the heat conductive area. Moreover, the end portion of the wide lead 5 is provided with a hole 7 the wide lead 5 is clamped by screwing to a supporting material using such hole. Therefore, a large amount of heat is conducted through the wide lead 5 and since heat is radiated direct to the supporting material from the wide lead 15, the heat radiating property of a hybrid integrated circuit device 1 can be enhanced. |
