| 摘要 |
PURPOSE:To provide a semiconductor device so structured that the element- forming face of a chip is hard to receive damage and liable to heat dissipation during assembly in regard to a semiconductor device, to more detail, which is a laminate of a plurality of chips to attain the effective utilization of chip mounting spaces. CONSTITUTION:This device comprises tabular insulative substrates 9 both of which have conductive pads 11a-11t, 12a-12t on plate faces chips 13a, 13b both of which have bump electrodes 14a-14t, 15a-15t on element-forming faces to correspond to the positions of the pads 11a-11t, 12a-12t. This device is constituted including that both plate faces of the insulative substrates 9 are loaded with the chips 13a,13b so that the pads 11a-11t, 12a-12t may contact the corresponding bump electrodes 14a-14t, 15a-15t. |
