| 摘要 |
<p>PURPOSE:To reduce resistance and inductance by arranging two sets of power supply leads in an overlapped manner by pinching insulation bodies formed into a plate shape thereby shortening the wiring between a circuit on a semiconductor chip and a capacity element. CONSTITUTION:Power supplying leads 5a to 5d are respectively formed into T-shaped plates with the length almost equal to one side in adjacent to a semiconductor chip 1 having a projected terminal portion and are respectively covered with insulating bodies 8a to 8d. Power supplying leads 6a to 6d are respectively formed on the plates similar to the power supplying leads 5a to 5d and are respectively overlapped with the power supplying leads 5a to 5d with the insulating bodies 8a to 8d sandwiched between them, thereby respectively forming a set of two power supplying leads.</p> |
