发明名称 LEAD FOR SOLDERING
摘要 PURPOSE:To facilitate the positioning of a lead end portion, by soldering a lead wherein the tip portion is divided bifurcately and bent, to a soldering pad formed at end edge corner part of a molded body so as to be bent in an L-type. CONSTITUTION:The tip of a lead 12 is soldered to a soldering pad 14 formed so as to be bent in an L-type, by using solder material 16 like silver solder. At this time, a division segment 13 of the lead 12 is soldered to a metalized layer exposed on the upper surface of a ceramic molded body 10. A division segment 15 of the lead 12 is soldered to the exposed surface of the metalized layer exposed on the side surface of the ceramic molded body 10. The lead 12 is so bent that the division segment 15 becomes rectangular to the division segment 13. Thereby the lead 12 is so positioned that the angle between the end edge of the ceramic molded body 10, whose end edge angle part is rectangle, and the lead 12 becomes 90 deg..
申请公布号 JPH04287354(A) 申请公布日期 1992.10.12
申请号 JP19910076747 申请日期 1991.03.15
申请人 SHINKO ELECTRIC IND CO LTD 发明人 KOBAYASHI HIROYUKI
分类号 H01L23/15;H01L23/48;H01L23/50;H05K3/34 主分类号 H01L23/15
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