摘要 |
<p>PURPOSE:To obtain the fixing method of a two-layered structure film carrier main body which is excellent in cost performance, workability and productivity, and does not damage said body when a polyimide resin layer is subjected to cut working. CONSTITUTION:In the manufacturing method of a film carrier wherein device holes and the like are formed by cutting a polyimide resin layer (b) of a two- layered structure film carrier main body, a suction fixing jig (f) is constituted by forming suction grooves (d) or suction holes (d), only at part positions corresponding with the parts except said device holes and the like.</p> |