| 摘要 |
<p>PURPOSE:To avoid the crosstalk between rapidly operating multiple bare LSI chips by a simple structure for cutting down the cost of a module by a method wherein the grand patterns on a printed wiring board provided on respective bare chips are completely separated while respective grand patterns are directly connected to a metallic case through the intermediary of metallic pins. CONSTITUTION:The grand patterns of a printed-wiring board provided on respective bare LSI chips 32a, 32b are completely separated while power supply patterns provided on respective bare LSI chips 32a, 32b are substantially separated for the formation to be connected with each other by fine patterns only. Next, the printed-wiring board 34 is contained in a metallic case 42 and then a multitude of bare LSI chips 32a, 32b are directly mounted on the board 34 while the grand patterns provided on respective bare LSI chips 32a, 32b are connected to the metallic case 42 by the metallic pins 50 inserted into through holes so that the title semiconductor module comprising said printed-wiring board 34 mounted with a multitude of bare LSI chips 32a, 32b may be composed.</p> |
