| 摘要 |
PURPOSE:To prepare a heat-resistant film excellent in mechanical and chemical properties, profitability, and adhesion to an inorg. material by blending an arom. polyamide having specific diamine residues with a sol. resin. CONSTITUTION:A heat-resistant film is prepd. from a resin blend comprising 5-90wt.% arom. polyamide wherein 1-50mol% of all the diamine residues contain at least one kind of element selected from the group consisting of Si, Ge, and Sn and 10-95wt.% sol. resin. The film does not flow even above the softening point of the sol. resin, has a low thermal shrinkage and an excellent dimensional stability at high temp., has higher mechanical properties, such as tensile strength and elongation at break, than those of a film comprising the sol. resin alone, and hence can be easily handled in the secondary processing. Moreover, when the amt. blended of the sol. resin exceeds 50wt.%, the moisture absorption properties are improved. |
