发明名称 FORMING METHOD OF MINUTE WIRING PATTERN ON CERAMIC GREEN SHEET
摘要 PURPOSE:To form a minute wiring pattern on a ceramic green sheet. CONSTITUTION:A photoresist 2 constituted of photosensitive resin is applied by coating on a green sheet 1 constituted of ceramic powder for a multilayer wiring board and then exposure and development are conducted, so as to form a desired photoresist pattern. A conductor paste 3 is filled up in a recession formed thereby and the photoresist 2 is removed thereafter. Thereby a very minute wiring pattern is formed on the ceramic green sheet 1 for the multilayer wiring board.
申请公布号 JPH04283946(A) 申请公布日期 1992.10.08
申请号 JP19910072323 申请日期 1991.03.12
申请人 NEC CORP 发明人 HO KEIICHIRO
分类号 H01L23/12;H01L23/15;H05K1/09;H05K3/10;H05K3/46 主分类号 H01L23/12
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