| 摘要 |
<p>PURPOSE:To prevent large irregularity at the cutting face of a semiconductor chip in chipping. CONSTITUTION:A plurality of semiconductor chip areas (12) are made, a scrub line (14) is provided between neighboring semiconductor chips, and insulating layers (26 and 28) with small widths extending on both sides of the center line of that scrub line are provided on that scrub line. The semiconductor wafer of this sort is cut between the insulating layers with small widths extending on both sides of the center line of the scrub line with a dicing saw.</p> |
