| 摘要 |
PURPOSE: To prevent a sharing force from acting on a boding pad of a semiconductor die via a ground wire and to prevent the slacked ground wire from being in contact with the semiconductor die before it is resin-sealed with respect to the lead frame to which the bonding pad of the semiconductor frame on the lead frame is electrically connected through the ground wire. CONSTITUTION: A ground bond is formed to a ground pad like that for a semiconductor die 11 mounted on a die mount pad of the lead frame 10 via ground wires 14, 15. The ground bond is formed between pedestals 12a, 13a raised higher than an upper face of the semiconductor die 11 from the die mount pad through press processing or the like and the ground pad on the upper face of the semiconductor die 11. The pedestals 12a, 13a and the semiconductor die 11 are integrally resin-sealed. |
