| 摘要 |
<p>PURPOSE:To improve the productivity, reduce the defective products after formation of resin armor, and simplify the tester, concerning the lead frame, the semiconductor device using its lead frame, and the manufacture of its semiconductor device. CONSTITUTION:In the outer frame 6 of a lead frame 21, a plurality of leads 4, pinch bars 3 which communicate with the a die stage 2, and projections 22 the tops of which break in the resin armor 8, are made coupled with each other. The semiconductor device where the pinch bars 3, the leads 4, and the projections 22 are cut off the outer frame 6 after loading a semiconductor chip 7 on the die stage 2 of the lead frame 21 and forming the resin armor 8. As the manufacture of the semiconductor device, after cutting the lead 4 off the outer frame 6, the property test is performed using the lead 4, and then the pinch bars 3 and the projections 22 are cut off the outer frame 6.</p> |
