| 摘要 |
PURPOSE:To facilitate the stable compound oscillations by a method wherein the bonding step is performed by simultaneously oscillating the wedge side and the electrode side using ultrasonics. CONSTITUTION:In order to bond wires 5 onto the electrode 1 on a chip 2 side and the other electrode 3 on a substrate 4 side, a wedge 6 is laterally oscillated in the X direction by an ultrasonic oscillator 7a. Simultaneously, the electrodes 1, 3 as the elements to be junctioned are oscillated in the Y direction by another ultrasonic oscillator 7b on the plane in parallel with the direction of the lateral oscillation. Through these procedures, in order to wire-bond the electrodes 1, 3, the wedge 6 side and the electrodes 1, 3 side can simultaneously be oscillated so that the oscillation systems may separately be designed thereby enabling enabling the stable compound oscillations to be facilitated comparing with the conventional case wherein the compound oscillations are performed on the wedge side only. |
