发明名称 POSITIVE TYPE PHOTORESIST COMPOSITION
摘要 PURPOSE:To improve a resolving power, faithful reproducibility and heat resistance and to expand development latitude as well as to allow the formation of resist patterns having sectional shapes of a high aspect ratio by incorporating specific photosensitive materials and alkaline-soluble resin. CONSTITUTION:This compsn. contains at least one kind of the photosensitive materials expressed by formula I and the alkaline-soluble resin. In the formula I, R denotes a hydrogen atom, etc.; at least one of three Rs is exclusive of the hydrogen atom; X denotes -S-, etc.; Y denotes a hydrogen atom, 1 to 4C alkyl group, etc. The novolak resin as the alkaline-soluble resin is obtd. by bringing 0.6 to 1.0mol aldehydes into addition condensation with 1mol phenols in the presence of an acid catalyst. The ratio of using the photosensitive materials and the alkaline-soluble novolak resin is 5 to 100 pts.wt., more preferably 10 to 50 pts.wt. photosensitive material per 100 pts.wt. novolak resin.
申请公布号 JPH04274431(A) 申请公布日期 1992.09.30
申请号 JP19910057712 申请日期 1991.03.01
申请人 FUJI PHOTO FILM CO LTD 发明人 UENISHI KAZUYA;NISHIYAMA FUMIYUKI;KOKUBO TADAYOSHI
分类号 G03F7/022;H01L21/027 主分类号 G03F7/022
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