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发明名称
ETCHING METHOD FOR SEMICONDUCTOR WAFER
摘要
申请公布号
JPH04273123(A)
申请公布日期
1992.09.29
申请号
JP19910034024
申请日期
1991.02.28
申请人
KAWASAKI STEEL CORP
发明人
MATSUKAWA NAOKI
分类号
H01L21/302;H01L21/3065
主分类号
H01L21/302
代理机构
代理人
主权项
地址
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