| 摘要 |
PURPOSE: To provide an IC package for sealing a semiconductor integrated circuit, especially, a memory chip and a back-up battery for holding memory data at the time of the power failure of a power source. CONSTITUTION: A volatile memory chip 12 and a back-up battery 32 for holding data at the time of the power failure of a main power source are sealed in an IC package 60. The IC package 60 is provided with a finger lead polymer 20 sealed in a package main body 30 made of non-conductive material in a state in which a coplanar base support finger lead 62 crosses a mutual connecting area 22. One terminal 32P of a battery 32 is welded to the base support finger lead 62, and the IC chip 12 is directly adhered to the other battery terminal 32N. The layered product of the IC chip 12, the battery 32, and the base supporting finger lead 62 are arranged at the center, and the layered product is completely sealed in the package main body 30. |
