| 摘要 |
PURPOSE:To provide a multilayer wiring board manufacturing method where a multilayer wiring board excellent in electrical properties and accuracy and free from separation can be easily manufactured at a low cost. CONSTITUTION:A first wiring pattern 2 is provided to a copper foil of a copper plated glass epoxy resin board 1, and then epoxy adhesive agent is applied onto the whole surface for the formation of an adhesive agent layer 3. In succession, glass powder 4 is scattered, the adhesive agent layer 3 is set, and a glass powder scattered surface is plated with copper using copper sulfate to form a copper foil layer 5. A second wiring pattern 6 is provided to the copper foil layer 5 for the formation of a multilayer wiring board of two-layered structure. Furthermore, epoxy adhesive agent is applied onto the second wiring pattern 6 to form an adhesive agent layer again, and the same process is repeated as above to form a multilayer wiring board of three-layered structure or above. |
