发明名称 MICROWAVE COMPONENT MOUNTING
摘要 <p>A method of making a microwave semiconductor component and concurrently forming therewith a mounting membrane adapted for positioning the semiconductor component in an RF transmission medium such as a waveguide. Substantially concurrently with the deposition of a metallic film in connection with forming a semiconductor elements, there is deposited a metallic membrane on the base silicon substrate and outside of the circuit element. The outer periphery of the base substrate is removed to expose the membrane. The metallic membrane is preferably of gold.</p>
申请公布号 EP0231560(B1) 申请公布日期 1992.09.23
申请号 EP19860300398 申请日期 1986.01.21
申请人 M/A-COM, INC. 发明人 ARMSTRONG, ALBERT L.;MORONEY, WILLIAM
分类号 H01L23/66;H03G11/02 主分类号 H01L23/66
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