| 摘要 |
PURPOSE:To provide a minimized aluminum pad with small spacing of the pads, by tearing off a wire with a clamp after the wire is wedge bonded by compression at a necessary amount onto an aluminum pad. CONSTITUTION:An end part of wire 7 is wedge bonded to an aluminum pad 2 on a wafer 3 with a wedge 5. Then, when a wire 7 is picked upward with a clump, there remains a collapsed part of the wire on the aluminum pad 2. In this case, because of wedge bonding, a length A and a width B can be limited below about two times the wire diameter D and below about one and a half times the wire diameter D, respectively. Consequently, when a wire of a 20mu diameter is used, then the area of the aluminum pad 2 can be adjusted to be about 40mu square, and thereby the small spacing of the aluminum pads 2 can be obtained. |
